Interfacial delamination and delamination mechanism maps for 3D printed flexible electrical interconnects
نویسندگان
چکیده
منابع مشابه
Interfacial Delamination in Integrated Microsystems
Introduction Due to the goal of increasing functionality and decreasing costs in micro-electronic packages, integrated circuit processing and miniaturized fabrication technologies have been combined to result in microsystems such as System In Packages (SIP). Microsystems consist of multiple thin and stacked layers, manufactured using different materials. Hence, interfacial failures, mainly in t...
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ژورنال
عنوان ژورنال: Extreme Mechanics Letters
سال: 2021
ISSN: 2352-4316
DOI: 10.1016/j.eml.2021.101199